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#31 CROSSTALK IEEE EMC Society Podcast 2023 - Gene Saltzberg 2023 EMC+SIPI Deadline Paper Submission March 6

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Manage episode 356042866 series 2942045
Content provided by IEEE EMC SOCIETY. All podcast content including episodes, graphics, and podcast descriptions are uploaded and provided directly by IEEE EMC SOCIETY or their podcast platform partner. If you believe someone is using your copyrighted work without your permission, you can follow the process outlined here https://player.fm/legal.

Welcome to the CROSSTALK - the IEEE EMC Society Podcast.
Hear us above the Noise!
The Podcast to discuss interesting topics on electromagnetic compatibility to our technical community.
In this special issue, focusing on the 2023 IEEE INTERNATIONAL SYMPOSIUM
ON ELECTROMAGNETIC COMPATIBILITY, SIGNAL & POWER INTEGRITY held in-person from July 31- August 4 in Grand Rapids, Michigan.

We will talk with Gene Saltzberg, he is part of the organizing committee and Technical Program Chair. Gene will point out the paper submission, which is March 6 for:

  • Abstract Reviewed Papers
  • Workshops and Tutorials
  • Experiments and Demonstrations
  • Student EMC Hardware Design Contest

Information about the 2023 International IEEE EMC+SIPI symposium: https://emc2023.org/
Call for submissions: https://emc2023.org/call-for-submissions.html
Infos on student EMC hardware design contest: https://emc2023.org/student-emc-hardware-design-competition.html

  continue reading

55 episodes

Artwork
iconShare
 
Manage episode 356042866 series 2942045
Content provided by IEEE EMC SOCIETY. All podcast content including episodes, graphics, and podcast descriptions are uploaded and provided directly by IEEE EMC SOCIETY or their podcast platform partner. If you believe someone is using your copyrighted work without your permission, you can follow the process outlined here https://player.fm/legal.

Welcome to the CROSSTALK - the IEEE EMC Society Podcast.
Hear us above the Noise!
The Podcast to discuss interesting topics on electromagnetic compatibility to our technical community.
In this special issue, focusing on the 2023 IEEE INTERNATIONAL SYMPOSIUM
ON ELECTROMAGNETIC COMPATIBILITY, SIGNAL & POWER INTEGRITY held in-person from July 31- August 4 in Grand Rapids, Michigan.

We will talk with Gene Saltzberg, he is part of the organizing committee and Technical Program Chair. Gene will point out the paper submission, which is March 6 for:

  • Abstract Reviewed Papers
  • Workshops and Tutorials
  • Experiments and Demonstrations
  • Student EMC Hardware Design Contest

Information about the 2023 International IEEE EMC+SIPI symposium: https://emc2023.org/
Call for submissions: https://emc2023.org/call-for-submissions.html
Infos on student EMC hardware design contest: https://emc2023.org/student-emc-hardware-design-competition.html

  continue reading

55 episodes

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