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Jean-Christophe Eloy and Jan Vardaman Explain How Chiplets and Advanced Packaging will Rule the World
Manage episode 399934897 series 2935206
Content provided by Francoise von Trapp. All podcast content including episodes, graphics, and podcast descriptions are uploaded and provided directly by Francoise von Trapp or their podcast platform partner. If you believe someone is using your copyrighted work without your permission, you can follow the process outlined here https://player.fm/legal.
In this episode, Françoise von Trapp and Jean Christophe Eloy of Yole Group, discuss the future of advanced packaging and chiplets in the semiconductor industry, and how these technologies will revolutionize the industry.
Get ready for a deep dive into a technology discussion. From Jean-Christophe, you’ll learn how chiplets differ from multichip modules (MCM) and systems-in-package (SiP). He highlights the benefits of chiplets, including optimizing different nodes for specific functions. You’ll also learn about important enabling technologies that ensure the fast and robust connections that hallmark chiplets.
Françoise and Jean-Christophe also discuss the key applications using chiplets for their cost-savings and sustainability benefits.
In a bonus interview with Jan Vardaman of TechSearch International, Francoise and Jan discuss how chiplets provide the power efficiency needed for next-generation semiconductor devices.
Contact Our Speakers on LinkedIn:
- Jean-Christophe Eloy, President and CEO, Yole Group
- E. Jan Vardaman, President, Techsearch International
A global association, SEMI represents the entire electronics manufacturing and design supply chain.
Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.
Support the Show.
Become a sustaining member!
Like what you hear? Follow us on LinkedIn and Twitter
Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.
Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
133 episodes
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Manage episode 399934897 series 2935206
Content provided by Francoise von Trapp. All podcast content including episodes, graphics, and podcast descriptions are uploaded and provided directly by Francoise von Trapp or their podcast platform partner. If you believe someone is using your copyrighted work without your permission, you can follow the process outlined here https://player.fm/legal.
In this episode, Françoise von Trapp and Jean Christophe Eloy of Yole Group, discuss the future of advanced packaging and chiplets in the semiconductor industry, and how these technologies will revolutionize the industry.
Get ready for a deep dive into a technology discussion. From Jean-Christophe, you’ll learn how chiplets differ from multichip modules (MCM) and systems-in-package (SiP). He highlights the benefits of chiplets, including optimizing different nodes for specific functions. You’ll also learn about important enabling technologies that ensure the fast and robust connections that hallmark chiplets.
Françoise and Jean-Christophe also discuss the key applications using chiplets for their cost-savings and sustainability benefits.
In a bonus interview with Jan Vardaman of TechSearch International, Francoise and Jan discuss how chiplets provide the power efficiency needed for next-generation semiconductor devices.
Contact Our Speakers on LinkedIn:
- Jean-Christophe Eloy, President and CEO, Yole Group
- E. Jan Vardaman, President, Techsearch International
A global association, SEMI represents the entire electronics manufacturing and design supply chain.
Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.
Support the Show.
Become a sustaining member!
Like what you hear? Follow us on LinkedIn and Twitter
Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.
Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
133 episodes
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Similar to 3D InCites Podcast
Android Backstage, a podcast by and for Android developers. Hosted by developers from the Android engineering team, this show covers topics of interest to Android programmers, with in-depth discussions and interviews with engineers on the Android team at Google. Subscribe to Android Developers YouTube → https://goo.gle/AndroidDevs
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The American healthcare system is one of the most innovative in the world. But it’s also riddled with complex challenges, such as access to affordable medications, inefficiency and administrative burdens, and communication barriers between providers. There’s clearly a better way—and at Surescripts, we have a unique sightline into what that may be. In this series, host Melanie Marcus, Chief Marketing Officer of Surescripts, sits down with today’s most inspiring and innovative leaders in healt ...
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